Adhesive Heatsink Plaster Thermal Conductive Adhesive - 5g
Application: apply IC, GPU, or High Power LED to all heat sink with no fixed buckle under the circumstance of thermal paste
Product features: good thermal performance, strong bonding strength.
Temperature: 200 °C resistance.
STARS-922 sticky control better, and not just have to stick on the violence can be removed, in fact as long as a little with some force can take the heat sink (or so few that is desirable rotation), after dismantling the with paper towel to wipe clean can, this is recommended: like general 3 M double adhesive failure of thermal conductivity of heat sink after it, it is difficult to remove residual glue, go against secondary, and joint STARS-922 very easy to remove (such as above).
Another 922 STARS- the thermal conductivity is superior to heat conduction two-side glue, due to thermal conductivity double-sided gum too low, cannot be directly used in CPU heat conduction, only applies to heat small chip.
Thermal properties, strong adhesion.
Melting capacity: 0 (200degree celsius/ 24Hours)
Evaporation: 0.001% (200 degree celsius/ 24Hours)
Thermal conductivity:> 1.2W/m-K
Thermal Impedance: <0.06
Clotting time: 3min (25 degree celsius)
Strength of connected buildings: 25Kg
Insulation coefficient> 5.1
Dissipation coefficient <0.005
Temperature resistance: 200 degree celsius
Net Weight: 5g
viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels.